CAMDS对应IMDS应用信息一览

2022/7/15

CAMDS对应IMDS应用信息一览

Alloying element in copper [3]

铜合金

Carbon brushes for electric motors [12]

电机碳刷

Other application (potentially prohibited) [20]

其他应用(潜在禁止)

Copper in friction materials of brake linings [43]

制动衬片摩擦材料中的铜

Concentration within acceptable GADSL limits [44]

除电路板或玻璃外其他电子产品中的焊料中的铅

Alloying element in bearing shells and bushes in engines, transmissions and air conditioning compressors. [51]

发动机、变速箱和空气压缩机用轴瓦和衬套

Alloying element in bearing shells and bushes for all other applications (potentially prohibited). [52]

发动机、变速箱和空气压缩机以外部件用轴瓦和轴套(潜在禁止)

Lead in solder used in electronic circuit board applications - 8a) [53]

集成电路封闭内部电气连接的含铅焊料

Lead in solders in electrical applications other than soldering on electronic circuit boards or on glass - 8b) [54]

电路板及其其他电气部件的焊料

Lead in finishes on terminals of electrolyte aluminium capacitors - 8c) [55]

电解电容/铝电容引脚上的焊料

Lead used in soldering on glass in mass airflow sensors - 8d) [56]

大气流传感器中玻璃上的含铅焊料

Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) - 8e) [57]

高温焊料(即铅的质量分数≧85%的铅合金)中的铅

Lead in compliant pin connector systems - 8f) [58]

顺压针连接器系统中的铅

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages - 8g) [59]

用于将电子、电气元器件焊接到电路板上所使用的含铅焊料以及电解电容/铝电容之外元器件可焊性而附着的焊料

Lead in solder to attach heat spreaders to the heat sink in power semiconductor assemblies - 8h) [60]

功率半导体设备中焊接散热器与散热片的焊料

Lead in solders in electrical glazing applications on glass except for soldering in laminated glazing - 8i) [61]

除夹层玻璃外其他电器上玻璃上的用的焊料中的铅

Lead in solders for soldering in laminated glazing - 8j) [62]

夹层玻璃的焊料

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